Inhibiting cracking of interfacial Cu6Sn5 by Ni additions to Sn-based Lead-free solders

Nogita, Kazuhiro, McDonald, Stuart D., Tsukamoto, Hideaki, Read, Jonathan, Suenaga, S. and Nishimura, T. (2009) Inhibiting cracking of interfacial Cu6Sn5 by Ni additions to Sn-based Lead-free solders. Transactions of the Japan Institute of Electronics Packaging, 2 1: 46-54.

Author Nogita, Kazuhiro
McDonald, Stuart D.
Tsukamoto, Hideaki
Read, Jonathan
Suenaga, S.
Nishimura, T.
Title Inhibiting cracking of interfacial Cu6Sn5 by Ni additions to Sn-based Lead-free solders
Journal name Transactions of the Japan Institute of Electronics Packaging   Check publisher's open access policy
ISSN 1883-3365
Publication date 2009
Sub-type Article (original research)
Open Access Status
Volume 2
Issue 1
Start page 46
End page 54
Total pages 9
Editor Ichiro Koiwa
Place of publication Tokyo, Japan
Publisher Japan Institute of Electronics Packaging
Language eng
Subject 091099 Manufacturing Engineering not elsewhere classified
861603 Integrated Circuits and Devices
Q-Index Code CX
Q-Index Status Provisional Code

Document type: Journal Article
Sub-type: Article (original research)
Collection: School of Mechanical & Mining Engineering Publications
 
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Created: Mon, 12 Apr 2010, 10:30:25 EST by Susan Morrison on behalf of School of Mechanical and Mining Engineering