Nanoindentation characterization of intermetallic compounds formed between Sn-Cu(-Ni) ball grid arrays and Cu substrates

Tsukamoto, Hideaki, Dong, Zhigang, Huang, Han, Nishimura, Tetsuro and Nogita, Kazuhiro (2009) Nanoindentation characterization of intermetallic compounds formed between Sn-Cu(-Ni) ball grid arrays and Cu substrates. Materials Science and Engineering B, 164 1: 44-50. doi:10.1016/j.mseb.2009.06.013


Author Tsukamoto, Hideaki
Dong, Zhigang
Huang, Han
Nishimura, Tetsuro
Nogita, Kazuhiro
Title Nanoindentation characterization of intermetallic compounds formed between Sn-Cu(-Ni) ball grid arrays and Cu substrates
Journal name Materials Science and Engineering B   Check publisher's open access policy
ISSN 0921-5107
Publication date 2009-08-15
Sub-type Article (original research)
DOI 10.1016/j.mseb.2009.06.013
Volume 164
Issue 1
Start page 44
End page 50
Total pages 6
Editor P.N. Kumta
Place of publication Amsterdam, The Netherlands
Publisher Elsevier Science
Collection year 2010
Language eng
Subject C1
091099 Manufacturing Engineering not elsewhere classified
861603 Integrated Circuits and Devices
Formatted abstract
The formation of intermetallic compounds (IMCs) at the solder–substrate interface is essential in the manufacturing of solder joints. In this study, the effect of Ni addition into Sn–Cu lead-free solders on mechanical properties of the IMCs formed at the interface between solder ball grid arrays (BGAs) and Cu substrates, which experienced multiple reflows, were investigated. The results from nanoindentation tests showed that elastic modulus and hardness of (Cu,Ni)6Sn5 were higher than those of Cu6Sn5. The hardnesses of (Cu,Ni)6Sn5 were more scattered compared to those of Cu6Sn5, which may be attributed to the crystallographic characteristics such as growth texture of the IMCs.
Keyword Nanoindentation
Mechanical property
Intermetallic compound
Lead-free solder
Free solder joints
Mechanical Properties
Interfacial reaction
Multiple reflows
Elastic modulus
Shear strength
SNAGCU solder
BGA package
Thin films
Reliability
Q-Index Code C1
Q-Index Status Confirmed Code
Institutional Status UQ
Additional Notes Available online 3 July 2009.

Document type: Journal Article
Sub-type: Article (original research)
Collections: 2010 Higher Education Research Data Collection
School of Mechanical & Mining Engineering Publications
 
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Created: Thu, 01 Apr 2010, 15:34:00 EST by Susan Morrison on behalf of School of Mechanical and Mining Engineering