Role of Ni in stabilization of intermetallic compounds in Sn-Cu alloys

Nogita, K., Nishimura, T., Suenaga, S., McDonald, S. D., Sweatman, K. and Tsukamoto, H. (2008). Role of Ni in stabilization of intermetallic compounds in Sn-Cu alloys. In: Japanese Institute of Metals Annual Autumn Meeting 2008, Kumamoto, Japan, (). 23-25 September 2008.

Author Nogita, K.
Nishimura, T.
Suenaga, S.
McDonald, S. D.
Sweatman, K.
Tsukamoto, H.
Title of paper Role of Ni in stabilization of intermetallic compounds in Sn-Cu alloys
Conference name Japanese Institute of Metals Annual Autumn Meeting 2008
Conference location Kumamoto, Japan
Conference dates 23-25 September 2008
Publication Year 2008
Sub-type Oral presentation
Language eng
Subjects 0912 Materials Engineering
Keyword Nickel
Tin
Copper
Alloys
Intermetallic compounds
Q-Index Code EX
Q-Index Status Provisional Code
Institutional Status Unknown

 
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Created: Mon, 08 Mar 2010, 14:40:48 EST by Michael Affleck on behalf of Faculty Of Engineering, Architecture & Info Tech