Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys

Nogita, Kazuhiro (2010) Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys. Intermetallics, 18 1: 145-149. doi:10.1016/j.intermet.2009.07.005


Author Nogita, Kazuhiro
Title Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys
Formatted title
Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys
Journal name Intermetallics   Check publisher's open access policy
ISSN 0966-9795
1879-0216
Publication date 2010-01
Sub-type Article (original research)
DOI 10.1016/j.intermet.2009.07.005
Volume 18
Issue 1
Start page 145
End page 149
Total pages 5
Place of publication Oxford, United Kingdom
Publisher Elsevier
Collection year 2011
Language eng
Formatted abstract
Cu6Sn5 exists at least in two crystal structures with an allotropic transformation from monoclinic η'-Cu6Sn5 at temperatures lower than 186 °C to hexagonal η-Cu6Sn5. We recently discovered that the hexagonal structure of Cu6Sn5 in lead-free solder alloys with trace Ni additions is stable down to room temperature using high resolution TEM/ED/EDS. This report further confirm the phase stabilising effect of Ni by analysing samples of Cu6Sn5 extracted from a Sn-0.7wt%Cu-0.05wt%Ni lead-free solder alloy. Techniques used include X-ray diffraction, transmission electron microscopy and differential scanning calorimetry. © 2009 Elsevier Ltd. All rights reserved.
Keyword Intermetallics, miscellaneous
Phase transformation
Joining
Microstructure
Microscopy, various
Q-Index Code C1
Q-Index Status Confirmed Code
Institutional Status UQ

Document type: Journal Article
Sub-type: Article (original research)
Collections: School of Mechanical & Mining Engineering Publications
Official 2011 Collection
 
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Created: Sun, 22 Nov 2009, 00:04:05 EST