Isothermal and thermal cycling aging on IMC growth rate in lead-free and lead-based solder interface

Xu, Luhua, Pang, John H. L., Prakash, Kithva H. and Low, T. H. (2005) Isothermal and thermal cycling aging on IMC growth rate in lead-free and lead-based solder interface. IEEE Transactions on Components and Packaging Technologies, 28 3: 408-414. doi:10.1109/TCAPT.2005.853593


Author Xu, Luhua
Pang, John H. L.
Prakash, Kithva H.
Low, T. H.
Title Isothermal and thermal cycling aging on IMC growth rate in lead-free and lead-based solder interface
Journal name IEEE Transactions on Components and Packaging Technologies   Check publisher's open access policy
ISSN 1521-3331
1557-9972
Publication date 2005-09-01
Sub-type Article (original research)
DOI 10.1109/TCAPT.2005.853593
Volume 28
Issue 3
Start page 408
End page 414
Total pages 7
Place of publication Piscataway, NJ, United States
Publisher IEEE
Language eng
Subject 091207 Metals and Alloy Materials
090301 Biomaterials
Abstract The growth of interfacial intermetallic compounds (IMC) between Pb-free and Pb-based solders with different surface finish (Cu and Ni/Au) metallization is a major concern for long-term solder joint reliability performance in electronic assemblies. The growth rate of the IMC layer can affect the solder joint reliability. Analysis of solid-state diffusion mechanism for the growth of IMC between solder-to-substrate interface for Pb-free and Pb-based solders subject to isothermal and thermal cycling aging were conducted. Experimental study of IMC layer growth between Sn3.8Ag0.7Cu and Ni/Au surface finish by isothermal aging versus thermal cycling (TC) aging was investigated to develop a framework for correlating IMC layer growth behavior. An integrated model for IMC growth was derived to describe the Ni-Cu-Sn IMC growth behavior subject to TC aging. Comparison of modeling and test results showed that IMC layer growth rate under TC aging was accelerated. It is noted that IMC layer growth study from various references showed different experimental data and growth kinetic parameters for both liquid-state and solid-state reactions.
Keyword Intermetallic compounds (IMC)
Lead-free solder
Solder joint
Thermal cycling aging
Q-Index Code C1
Q-Index Status Provisional Code
Institutional Status Non-UQ

Document type: Journal Article
Sub-type: Article (original research)
Collections: Excellence in Research Australia (ERA) - Collection
Australian Institute for Bioengineering and Nanotechnology Publications
 
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