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Mu, D., Huang, H. and Nogita, K. (2012) Anisotropic mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5. Materials Letters, 86 46-49. doi:10.1016/j.matlet.2012.07.018 191   9 Cited 11 times in Scopus11 0
Yang, Y. F., Mu, D. K. and Jiang, Q. C. (2014) A simple route to fabricate TiC-TiB2/Ni composite via thermal explosion reaction assisted with external pressure in air. Materials Chemistry and Physics, 143 2: 480-485. doi:10.1016/j.matchemphys.2013.10.003 33   2 Cited 2 times in Scopus2 0
Nogita, Kazuhiro, Mu, Dekui, McDonald, Stuart D., Read, Stuart D. and Sweatman, Keith (2013). Crack formation and propagation mechanisms in interfacial Cu6Sn5. In: ICEP 2013 Proceedings. ICEP 2013: International Conference on Electronic Packaging 2013, Osaka, Japan, (670-675). 10-12 April 2013. 94 13
Mu, Dekui, Huang, Han, McDonald, Stuart D. and Nogita, Kazuhiro (2013) Creep and mechanical properties of Cu6Sn5 and (Cu,Ni)(6)Sn-5 at elevated temperatures. Journal of Electronic Materials, 42 2: 304-311. doi:10.1007/s11664-012-2227-y 125   1 Cited 1 times in Scopus1 0
Mu, Dekui (2012). Critical properties of Cu6Sn5 for high-temperature and 3D lead-free soldering applications PhD Thesis, School of Mechanical and Mining Engineering, The University of Queensland. 329 25
Yang, Y. F. and Mu, D. (2014) Effect of Ni addition on the formation mechanism of Ti5Si3 during self-propagation high-temperature synthesis and mechanical property. Journal of the European Ceramic Society, 34 10: 2177-2185. doi:10.1016/j.jeurceramsoc.2014.02.018 28   0 Cited 0 times in Scopus0 1
Nogita, K., Mu, D., McDonald, S. D., Read, J. and Wu, Y. Q. (2012) Effect of Ni on phase stability and thermal expansion of Cu6-xNixSn5 (X=0, 0.5, 1, 1.5 and 2). Intermetallics, 26 78-85. doi:10.1016/j.intermet.2012.03.047 112   14 Cited 16 times in Scopus16 0
Mu, Dekui, Huang, Han and Nogita, Kazuhiro (2012). Effect of temperature on the mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5. In: TMS 2012 141st Annual Meeting and Exhibition, Orlando, United States, (). 11-15 March 2012. 85  
Mu, Dekui, Tsukamoto, Hideaki, Huang, Han and Nogita, Kazuhiro (2010). Formation and mechanical properties of intermetallic compounds in Sn-Cu high-temperature lead-free solder joints. In: Jian-Feng Nie and Allan Morton, 7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7. 7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7, Cairns, QLD, Australia, (2450-2454). 2-6 August, 2010. doi:10.4028/www.scientific.net/MSF.654-656.2450 135 5 6 Cited 6 times in Scopus6 0
Mu, Dekui, Yasuda, Hideyuki, Huang, Han and Nogita, Kazuhiro (2012) Growth orientations and mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5 on poly-crystalline Cu. Journal of Alloys and Compounds, 536 38-46. doi:10.1016/j.jallcom.2012.04.110 155   9 Cited 11 times in Scopus11 0
Mu, D., Huang, H., McDonald, S. D., Read, J. and Nogita, K. (2013) Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)(6)Sn-5 on diverse crystal planes. Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing, 566 126-133. doi:10.1016/j.msea.2012.12.057 93   2 Cited 2 times in Scopus2 0
Zeng, Guang, McDonald, Stuart D., Mu, Dekui, Terada, Yasuko, Yasuda, Hideyuki, Gu, Qinfen and Nogita, Kazuhiro (2014) Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints. Intermetallics, 54 20-27. doi:10.1016/j.intermet.2014.05.004 89   1 Cited 1 times in Scopus1 0
Yang, Y. F. and Mu, D. K. (2013) Rapid dehydrogenation of TiH2 and its effect on formation mechanism of TiC during self-propagation high-temperature synthesis from TiH2-C system. Powder Technology, 249 208-211. doi:10.1016/j.powtec.2013.08.020 26   0 Cited 0 times in Scopus0 0
Yang, Y. F. and Mu, D. K. (2014) Simultaneous Fast Dehydrogenation of TiH2 and Rapid Synthesis of TiB2-TiC Through Self-Propagating High-Temperature Synthesis of TiH2-B4C System. Metallurgical and Materials Transactions A, 45 8: 3184-3188. doi:10.1007/s11661-014-2307-0 54   0 Cited 0 times in Scopus0 0
Mu, D., Read, J., Yang, Y-F. and Nogita, K. (2011). Thermal expansion behavior of Cu6Sn5 in high-temperature leadfree solder joints. In: International Conference on Electronic Packaging ICEP. International Conference on Electronic Packaging (ICEP 2011), Nara, Japan, (). 13-15 April 2011. 58 10
Mu, Dekui, Read, Jonathan, Yang, Yafeng and Nogita, Kazuhiro (2011) Thermal expansion of Cu6Sn5 and (Cu,Ni)(6)Sn-5. Journal of Materials Research, 26 20: 2660-2664. doi:10.1557/jmr.2011.293 106   14 Cited 16 times in Scopus16 0