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Tsukamoto, Hideaki, Nishimura, T., Suenaga, S., McDonald, S. D., Read, J. and Nogita, K. (2009). Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints. In: MA2009: The International Conference and Exhibition on Materials and AustCeram 2009, Gold Coast, QLD, Australia, (10-16). 1-3 July 2009. 75   Cited 0 times in Scopus0
Nogita, Kazuhiro, Mu, Dekui, McDonald, Stuart D., Read, Stuart D. and Sweatman, Keith (2013). Crack formation and propagation mechanisms in interfacial Cu6Sn5. In: ICEP 2013 Proceedings. ICEP 2013: International Conference on Electronic Packaging 2013, Osaka, Japan, (670-675). 10-12 April 2013. 94 13
Wu, Y. Q., McDonald, S. D., Read, J., Huang, H. and Nogita, K. (2013) Determination of the minimum Ni concentration to prevent the η to η4+1 polymorphic transformation of stoichiometric Cu6Sn5. Scripta Materialia, 68 8: 595-598. doi:10.1016/j.scriptamat.2012.12.012 86   6 Cited 7 times in Scopus7 0
Nogita, K., Mu, D., McDonald, S. D., Read, J. and Wu, Y. Q. (2012) Effect of Ni on phase stability and thermal expansion of Cu6-xNixSn5 (X=0, 0.5, 1, 1.5 and 2). Intermetallics, 26 78-85. doi:10.1016/j.intermet.2012.03.047 112   14 Cited 15 times in Scopus15 0
Nogita, K., Gourlay, C., Read, J., Nishimura, T., Suenaga, S. and Dahle, A.K. (2008) Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder. Materials Transactions, 49 3: 443-448. doi:10.2320/matertrans.MBW200713 32   9 Cited 12 times in Scopus12 0
Hideaki Tsukamoto, Nishimura, T., Suenaga, S., McDonald, Stuart, Jonathan Read and Nogita, Kazuhiro (2009). Impact strength of Sn-Cu (-Ni) lead-free solder ball grid arrays placed on Cu substrates. In: Hideyuki Nishida, Proc. of Int. Conf. on Electronics Packaging 2009. Int. Conf. on Electronics Packaging 2009, Kyoto, Japan, (K14-2-3). 1-16 April 2009. 162  
McDonald, Stuart, Nogita, Kazuhiro, Read, Jonathan, Ventura, Tina and Nishimura, Tetsuro (2013) Influence of composition on the morphology of primary Cu6Sn5 in Sn-4Cu alloys. Journal of Electronic Materials, 42 2: 256-262. doi:10.1007/s11664-012-2222-3 52   3 Cited 2 times in Scopus2 0
Nogita, Kazuhiro, McDonald, Stuart D., Tsukamoto, Hideaki, Read, Jonathan, Suenaga, S. and Nishimura, T. (2009) Inhibiting cracking of interfacial Cu6Sn5 by Ni additions to Sn-based Lead-free solders. Transactions of the Japan Institute of Electronics Packaging, 2 1: 46-54. 81  
Nogita, K., Suenaga, S., McDonald, S. D., Tsukamoto. H., Read, J. and Nishimura, T. (2009). Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfaces. In: Hideyuki Nishida, Proceedings of the International Conference on Electronics Packaging 2009. ICEP 2009: International Conference on Electronics Packaging 2009, Kyoto, Japan, (1-6). 14-16 April, 2009. 100  
Gourlay, C. M., Nogita, K., Read, J. and Dahle, A. K. (2010) Intermetallic Formation and Fluidity in Sn-Rich Sn-Cu-Ni Alloys. Journal of Electronic Materials, 39 1: 56-69. doi:10.1007/s11664-009-0962-5 114   12 Cited 14 times in Scopus14 0
Mu, D., Huang, H., McDonald, S. D., Read, J. and Nogita, K. (2013) Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)(6)Sn-5 on diverse crystal planes. Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing, 566 126-133. doi:10.1016/j.msea.2012.12.057 93   2 Cited 2 times in Scopus2 0
Nogita, K., Gourlay, C. M., McDonald, S. D., Wu, Y. Q., Read, J. and Gu, Q. F. (2011) Kinetics of the eta-eta' transformation in Cu6Sn5. Scripta Materialia, 65 10: 922-925. doi:10.1016/j.scriptamat.2011.07.058 92   17 Cited 22 times in Scopus22 0
Zeng, Guang, McDonald, Stuart David, Read, Jonathan J., Gu, Qinfen and Nogita, Kazuhiro (2014) Kinetics of the polymorphic phase transformation of Cu6Sn5. Acta Materialia, 69 135-148. doi:10.1016/j.actamat.2014.01.027 93   3 Cited 3 times in Scopus3 0
Nogita, Kazuhiro, Read, Jonathan, Nishimura, Tetsuro, Sweatman, Keith, Suenaga, Shoichi and Dahle, Arne K. (2005) Microstructure control in Sn-0.7mass%Cu alloys. Materials Transactions, 46 11: 2419-2425. doi:10.2320/matertrans.46.2419 126 695 15 Cited 21 times in Scopus21 0
Nogita, K., Read, J., Tsukamoto, H., McDonald, S. D., Gourlay, C. M. and Nishimura, T. (2009). The Effect of Ni on Phase Stability in Cu6Sn5. In: Japan Institute of Metals Autumn Meeting 2009, Kyoto, Japan, (). 15-17 September 2009. 32  
Gourlay, C., Read, J., Nogita, K. and Dahle, A.K. (2008) The maximum fluidity length of solidifying Sn-Cu-Ag-Ni solder alloys. Journal of Electronic Materials, 37 1: 51-60. doi:10.1007/s11664-007-0248-8 36   16 Cited 15 times in Scopus15 0
Mu, D., Read, J., Yang, Y-F. and Nogita, K. (2011). Thermal expansion behavior of Cu6Sn5 in high-temperature leadfree solder joints. In: International Conference on Electronic Packaging ICEP. International Conference on Electronic Packaging (ICEP 2011), Nara, Japan, (). 13-15 April 2011. 58 10
Mu, Dekui, Read, Jonathan, Yang, Yafeng and Nogita, Kazuhiro (2011) Thermal expansion of Cu6Sn5 and (Cu,Ni)(6)Sn-5. Journal of Materials Research, 26 20: 2660-2664. doi:10.1557/jmr.2011.293 105   14 Cited 16 times in Scopus16 0
Tapsall, John, Read, Phillip, Carmody, Christopher, Bourne, Christopher, Ray, Sanghamitra, Limnios, Athena, Sloots, Theo and Whiley, David (2009) Two cases of failed ceftriaxone treatment in pharyngeal gonorrhoea verified by molecular microbiological methods.. Journal of Medical Microbiology, 58 5: 683-687. doi:10.1099/jmm.0.007641-0 51   56 Cited 61 times in Scopus61 0
Nogita, K., Gourlay, C. M., McDonald, S. D., Suenaga, S., Read, J., Zeng, G. and Gu, Q. F. (2013) XRD study of the kinetics of transformations in tin. Philosophical Magazine, 93 27: 3627-3647. doi:10.1080/14786435.2013.820381 57   3 Cited 3 times in Scopus3 2