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Tsukamoto, Hideaki (2011) A mean-field micromechanical approach to design of multiphase composite laminates. Materials Science And Engineering A-structural Materials Properties Microstructure And Processing, 528 7-8: 3232-3242. doi:10.1016/j.msea.2010.12.102 52   4 Cited 5 times in Scopus5 0
Tsukamoto, Hideaki (2010) A mean-field micromechanical formulation of a nonlinear constitutive equation of a two-phase composite. Computational Materials Science, 50 2: 560-570. doi:10.1016/j.commatsci.2010.09.019 44   0 Cited 0 times in Scopus0 0
Tsukamoto, Hideaki (2010) A mean-field micromechanical model of thermal-ratcheting behavior in short fiber-reinforced metal matrix composites. Acta Materialia, 58 10: 3709-3717. doi:10.1016/j.actamat.2010.03.008 19   4 Cited 4 times in Scopus4 0
Tsukamoto, H. (2010) A mean-field micromechanical study on thermal-cycling creep of short fiber-reinforced metal matrix composites: Al–Al3Ni eutectic composites. Materials Science and Engineering A, 527 18-19: 4967-4977. doi:10.1016/j.msea.2010.04.037 51   2 Cited 2 times in Scopus2 0
Tsukamoto, H., Kotousov, A., Ho, S.-Y. and Codrington, J. (2006). Analysis and design of functionally graded thermal coating. In: M. Hoffman and J. Price, Materials Australia : Proceedings of International Conference and Exhibition on Structural Integrity and Failure. International Conference and Exhibition on Structural Integrity and Failure (SIF2006), Sydney, Australia, (25-32). 27-29 September, 2006. 44  
Tsukamoto, Hideaki, Nishimura, T., Suenaga, S., McDonald, S. D., Read, J. and Nogita, K. (2009). Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints. In: MA2009: The International Conference and Exhibition on Materials and AustCeram 2009, Gold Coast, QLD, Australia, (10-16). 1-3 July 2009. 76   Cited 0 times in Scopus0
Tsukamoto, Hideaki (2010) Design against fracture of functionally graded thermal barrier coatings using transformation toughening. Materials Science and Engineering A, 527 13-14: 3217-3226. doi:10.1016/j.msea.2010.01.087 65   6 Cited 8 times in Scopus8 0
Tsukamoto, Hideaki (2010) Design of functionally graded thermal barrier coatings based on a nonlinear micromechanical approach. Computational Materials Science, 50 2: 429-436. doi:10.1016/j.commatsci.2010.08.035 34   5 Cited 6 times in Scopus6 0
Tsukamoto, H, Nishimura, T and Nogita, K (2009) Epitaxial growth of Cu6Sn5 formed at Sn-based lead-free solder/non-textured polycrystalline Cu plate interface. MATERIALS LETTERS, 63 30: 2687-2690. doi:10.1016/j.matlet.2009.09.041 103   14 Cited 16 times in Scopus16 0
Codrington, J., Nguyen, P., Ho, S-Y., Kotousov, A. and Tsukamoto ,H. (2006). Experimental apparatus for high temperature testing of thermo-mechanical properties. In: International Conference on Structural Integrity and Failure SIF 2006, Sydney, Australia, (148-153). 27 - 29 Sep 2006. 31  
Mu, Dekui, Tsukamoto, Hideaki, Huang, Han and Nogita, Kazuhiro (2010). Formation and mechanical properties of intermetallic compounds in Sn-Cu high-temperature lead-free solder joints. In: Jian-Feng Nie and Allan Morton, 7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7. 7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7, Cairns, QLD, Australia, (2450-2454). 2-6 August, 2010. doi:10.4028/www.scientific.net/MSF.654-656.2450 140 5 6 Cited 6 times in Scopus6 0
Blazewicz, A., Kotousov, A. and Tsukamoto, H. (2006). Generalization of the distributed dislocation techniques on problems with semi-infinite cracks. In: M. Hoffman and J. Price, Materials Australia : Proceedings of International Conference and Exhibition on Structural Integrity and Failure. International Conference on Structural Integrity and Failure: SIF2006, Sydney, Australia, (210-214). 27-29 September 2006. 33  
Hideaki Tsukamoto, Nishimura, T., Suenaga, S., McDonald, Stuart, Jonathan Read and Nogita, Kazuhiro (2009). Impact strength of Sn-Cu (-Ni) lead-free solder ball grid arrays placed on Cu substrates. In: Hideyuki Nishida, Proc. of Int. Conf. on Electronics Packaging 2009. Int. Conf. on Electronics Packaging 2009, Kyoto, Japan, (K14-2-3). 1-16 April 2009. 164  
Nogita, Kazuhiro, McDonald, Stuart D., Tsukamoto, Hideaki, Read, Jonathan, Suenaga, S. and Nishimura, T. (2009) Inhibiting cracking of interfacial Cu6Sn5 by Ni additions to Sn-based Lead-free solders. Transactions of the Japan Institute of Electronics Packaging, 2 1: 46-54. 86  
Nogita, K., Suenaga, S., McDonald, S. D., Tsukamoto. H., Read, J. and Nishimura, T. (2009). Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfaces. In: Hideyuki Nishida, Proceedings of the International Conference on Electronics Packaging 2009. ICEP 2009: International Conference on Electronics Packaging 2009, Kyoto, Japan, (1-6). 14-16 April, 2009. 102  
Tsukamoto, Hideaki and Kotousov, Andrei (2007) Micromechanical approach to transformation toughening in zirconia-enriched multi-phase composites. Journal of Mechanics of Materials and Structures, 2 5: 937-950. doi:10.2140/jomms.2007.2.937 38   1 Cited 1 times in Scopus1 0
Tsukamoto, Hideaki (2010) Micromechanical modeling of transformation toughening in multi-phase composites enriched with zirconia particles. Computational Materials Science, 48 4: 724-729. doi:10.1016/j.commatsci.2010.03.019 38   0 Cited 0 times in Scopus0 0
Tsukamoto, H. and Kotousov, A. (2006). Micromechanical modeling of transformation toughening mechanism in zirconia-enriched multi-phase composites. In: The First International Conference on Deformation and Fracture of Materials (DFM-2006), Moscow, Russia, (722-725). 13-16 Nov 2006. 39  
Tsukamoto, Hideaki and Kotousov, Andrei (2007). Micromechanical study on high-temperature behaviour of ZrO2 particle-dispersed Ni composites. In: N. Ohno and T. Uehara, Engineering plasticity and its applications from nanoscale to macroscale: Proceedings of the 8th Asia-Pacific Symposium on Engineering Plasticity and its Applications (AEPA2006). AEPA2006: The 8th Asia-Pacific Symposium on Engineering Plasticity and its Applications, Nagoya, Japan, (95-100). 25-29 September 2006. doi:10.4028/www.scientific.net/KEM.340-341.95 57   0 Cited 0 times in Scopus0 0
Tsukamoto, Hideaki, Dong, Zhigang, Huang, Han, Nishimura, Tetsuro and Nogita, Kazuhiro (2009) Nanoindentation characterization of intermetallic compounds formed between Sn-Cu(-Ni) ball grid arrays and Cu substrates. Materials Science and Engineering B, 164 1: 44-50. doi:10.1016/j.mseb.2009.06.013 163   16 Cited 18 times in Scopus18 0
Tsukamoto, Hideaki, Dong, Zigang, Huang, Han, Nishimura, Tetsuro and Nogita, Kazuhiro (2010). Nanoindentation characterization of intermetallics formed at the lead-free solder/Cu substrate interface. In: Jian-Feng Nie and Allan Morton, Proceedings of: PRICM 7: Selected peer reviewed papers from the Seventh Pacific Rim International Conference on Advanced Materials and Processing (PRICM-7). Pacific Rim International Conference on Advanced Materials and Processing, Cairns, Australia, (2446-2449). 2-6 August, 2010. doi:10.4028/www.scientific.net/MSF.654-656.2446 134 4 0 Cited 1 times in Scopus1 0
Nogita, K., Nishimura, T., Suenaga, S., McDonald, S. D., Sweatman, K. and Tsukamoto, H. (2008). Role of Ni in stabilization of intermetallic compounds in Sn-Cu alloys. In: Japanese Institute of Metals Annual Autumn Meeting 2008, Kumamoto, Japan, (). 23-25 September 2008. 43  
Tsukamoto, H., Nishimura, T., Suenaga, S. and Nogita, K. (2010) Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substrates. Materials Science and Engineering B, 171 1-3: 162-171. doi:10.1016/j.mseb.2010.03.092 162   12 Cited 13 times in Scopus13 0
Nogita, Kazuhiro, Yasuda, Hideyuki, Gourlay, Christopher M., Suenaga, Shoichi, Tsukamoto, Hideaki, McDonald, Stuart D., Takeuchi, Akihisa, Uesugi, Kentaro and Suzuki, Yoshio (2010) Synchrotron micro-XRF measurements of trace element distributions in BGA type solders and solder joints. Transactions of The Japan Institute of Electronics Packaging, 3 1: 40-46. 134 4
Nogita, K., Read, J., Tsukamoto, H., McDonald, S. D., Gourlay, C. M. and Nishimura, T. (2009). The Effect of Ni on Phase Stability in Cu6Sn5. In: Japan Institute of Metals Autumn Meeting 2009, Kyoto, Japan, (). 15-17 September 2009. 32  
Nogita, K., Gourlay, C. M., Nishimura, T., Suenaga, S., McDonald, S. D. and Tsukamoto, H. (2009). The influence of Ni content on cracking in IMC reaction layers between Sn-Cu-Ni solders and Cu substrates. In: Proceedings of TMS 2009. TMS 2009, San Francisco, California, USA, (). 15-19 February 2009. 62  
Tsukamoto, H., Nishimura, T., Suenaga, S., McDonald, S. D., Sweatman, K. W. and Nogita, K. (2011) The influence of solder composition on the impact strength of lead-free solder ball grid array joints. Microelectronics Reliability, 51 3: 657-667. doi:10.1016/j.microrel.2010.10.012 67   8 Cited 12 times in Scopus12 0
Tsukamoto, Hideaki, Nogita, Kazuhiro, McDonald, Stuart, Nishimura, Tetsuro, Suenaga, Shoichi and Sweatman, Keith W. (2009). The influence of solder composition on the impact strength of lead-free solder BGA joints. In: 2009 TMS Annual Meeting & Exhibition, San Francisco, CA, USA, (). 15 - 19 February 2009. 78  
Tsukamoto, H. (2007). Thermal cycling-induced superplasticity in short fibre-reinforced metal matrix composites. In: Julie Cairney and Simon Ringer, Materials Forum. Materials and Austceram 2007 International Conference, Sydney, Australia, (120-127). 4-6 July, 2007. 40  
Nogita, K., Yasuda, H., Gourlay, C. M., Suenaga, S., Tsukamoto, H., McDonald, S. D., Takeuchi, A., Uesugi, K. and Suzuki, Y. (2010). Trace element distribution in solder joints between Sn-based solders and Cu substrates. In: Miki Mori, Proceedings of the Tenth International Conference on Electronics Packaging (ICEP 2010). International Conference on Electronics Packaging ICEP2010, Sapporo, Hokkaido, Japan, (549-554). 12-14 May 2010. 236 83
Tsukamoto, Hideaki and Kotousov, Andrei (2006) Transformation toughening in zirconia-enriched composites: Micromechanical modeling. International Journal of Fracture, 139 1: 161-168. doi:10.1007/s10704-006-8374-5 44   Cited 5 times in Scopus5 0
Tsukamoto, H., Kotousov, A. and Codrington, J. (2006). Transformation toughening in zirconia-enriched multi-phase composites. In: M. Hoffman and J. Price, Materials Australia : Proceedings of International Conference and Exhibition on Structural Integrity and Failure. International Conference and Exhibition on Structural Integrity and Failure (SIF2006), Sydney, Australia, (427-433). 27-29 September, 2006. 49