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Zhou, L., Tian, Y. B., Huang, H., Sato, H. and Shimizu, J. (2012) A study on the diamond grinding of ultra-thin silicon wafers. Proceedings of the Institution of Mechanical Engineers Part B: Journal of Engineering Manufacture, 226 1: 66-75. doi:10.1177/0954405411414768 69   6 Cited 8 times in Scopus8 0