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Tsukamoto, Hideaki, Nishimura, T., Suenaga, S., McDonald, S. D., Read, J. and Nogita, K. (2009). Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints. In: MA2009: The International Conference and Exhibition on Materials and AustCeram 2009, Gold Coast, QLD, Australia, (10-16). 1-3 July 2009. 75   Cited 0 times in Scopus0
Nogita, K., Gourlay, C., Read, J., Nishimura, T., Suenaga, S. and Dahle, A.K. (2008) Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder. Materials Transactions, 49 3: 443-448. doi:10.2320/matertrans.MBW200713 34   9 Cited 12 times in Scopus12 0
Hideaki Tsukamoto, Nishimura, T., Suenaga, S., McDonald, Stuart, Jonathan Read and Nogita, Kazuhiro (2009). Impact strength of Sn-Cu (-Ni) lead-free solder ball grid arrays placed on Cu substrates. In: Hideyuki Nishida, Proc. of Int. Conf. on Electronics Packaging 2009. Int. Conf. on Electronics Packaging 2009, Kyoto, Japan, (K14-2-3). 1-16 April 2009. 162  
Nogita, Kazuhiro, McDonald, Stuart D., Tsukamoto, Hideaki, Read, Jonathan, Suenaga, S. and Nishimura, T. (2009) Inhibiting cracking of interfacial Cu6Sn5 by Ni additions to Sn-based Lead-free solders. Transactions of the Japan Institute of Electronics Packaging, 2 1: 46-54. 82  
Nogita, K., Suenaga, S., McDonald, S. D., Tsukamoto. H., Read, J. and Nishimura, T. (2009). Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfaces. In: Hideyuki Nishida, Proceedings of the International Conference on Electronics Packaging 2009. ICEP 2009: International Conference on Electronics Packaging 2009, Kyoto, Japan, (1-6). 14-16 April, 2009. 100  
Nogita, K., Nishimura, T., Suenaga, S., McDonald, S. D., Sweatman, K. and Tsukamoto, H. (2008). Role of Ni in stabilization of intermetallic compounds in Sn-Cu alloys. In: Japanese Institute of Metals Annual Autumn Meeting 2008, Kumamoto, Japan, (). 23-25 September 2008. 43  
Tsukamoto, H., Nishimura, T., Suenaga, S. and Nogita, K. (2010) Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substrates. Materials Science and Engineering B, 171 1-3: 162-171. doi:10.1016/j.mseb.2010.03.092 158   12 Cited 12 times in Scopus12 0
Nogita, K., Gourlay, C. M., Nishimura, T., Suenaga, S., McDonald, S. D. and Tsukamoto, H. (2009). The influence of Ni content on cracking in IMC reaction layers between Sn-Cu-Ni solders and Cu substrates. In: Proceedings of TMS 2009. TMS 2009, San Francisco, California, USA, (). 15-19 February 2009. 58  
Tsukamoto, H., Nishimura, T., Suenaga, S., McDonald, S. D., Sweatman, K. W. and Nogita, K. (2011) The influence of solder composition on the impact strength of lead-free solder ball grid array joints. Microelectronics Reliability, 51 3: 657-667. doi:10.1016/j.microrel.2010.10.012 66   8 Cited 12 times in Scopus12 0
Nogita, K., Yasuda, H., Gourlay, C. M., Suenaga, S., Tsukamoto, H., McDonald, S. D., Takeuchi, A., Uesugi, K. and Suzuki, Y. (2010). Trace element distribution in solder joints between Sn-based solders and Cu substrates. In: Miki Mori, Proceedings of the Tenth International Conference on Electronics Packaging (ICEP 2010). International Conference on Electronics Packaging ICEP2010, Sapporo, Hokkaido, Japan, (549-554). 12-14 May 2010. 235 81
Nogita, K., Gourlay, C. M., McDonald, S. D., Suenaga, S., Read, J., Zeng, G. and Gu, Q. F. (2013) XRD study of the kinetics of transformations in tin. Philosophical Magazine, 93 27: 3627-3647. doi:10.1080/14786435.2013.820381 57   3 Cited 3 times in Scopus3 2