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Tsukamoto, Hideaki, Nishimura, T., Suenaga, S., McDonald, S. D., Read, J. and Nogita, K. (2009). Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints. In: MA2009: The International Conference and Exhibition on Materials and AustCeram 2009, Gold Coast, QLD, Australia, (10-16). 1-3 July 2009. 76   Cited 0 times in Scopus0
Sweatman, K., Nishimura, T., McDonald, S. and Nogita, K. (2012) Effect of cooling rate on the intermetallic layer in solder joints. SMT Surface Mount Technology Magazine, 27 11: 68-77. 52   Cited 0 times in Scopus0
Nogita, K., Gourlay, C., Read, J., Nishimura, T., Suenaga, S. and Dahle, A.K. (2008) Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder. Materials Transactions, 49 3: 443-448. doi:10.2320/matertrans.MBW200713 34   9 Cited 12 times in Scopus12 0
Sweatman, K., Mcdonald, S. D., Whitewick, M., Nishimura, T. and Nogita, K. (2013). Grain refinement for improved lead-Free solder joint reliability. In: IPC APEX EXPO Conference & Exhibition 2013: Proceedings. IPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013, San Diego, United States, (561-589). 19-21 February 2013. 111   Cited 0 times in Scopus0
Hideaki Tsukamoto, Nishimura, T., Suenaga, S., McDonald, Stuart, Jonathan Read and Nogita, Kazuhiro (2009). Impact strength of Sn-Cu (-Ni) lead-free solder ball grid arrays placed on Cu substrates. In: Hideyuki Nishida, Proc. of Int. Conf. on Electronics Packaging 2009. Int. Conf. on Electronics Packaging 2009, Kyoto, Japan, (K14-2-3). 1-16 April 2009. 162  
Nogita, Kazuhiro, McDonald, Stuart D., Tsukamoto, Hideaki, Read, Jonathan, Suenaga, S. and Nishimura, T. (2009) Inhibiting cracking of interfacial Cu6Sn5 by Ni additions to Sn-based Lead-free solders. Transactions of the Japan Institute of Electronics Packaging, 2 1: 46-54. 82  
Nogita, K., Suenaga, S., McDonald, S. D., Tsukamoto. H., Read, J. and Nishimura, T. (2009). Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfaces. In: Hideyuki Nishida, Proceedings of the International Conference on Electronics Packaging 2009. ICEP 2009: International Conference on Electronics Packaging 2009, Kyoto, Japan, (1-6). 14-16 April, 2009. 100  
Nogita, K., Greaves, M., Guymer, B., Walsh, B., Kennedy, J., Duke, M. and Nishimura, T. (2010). Lead-free solders for electric vehicles - Global Green Challenge: Eco-challenge racing. In: Miki Mori, ICEP 2010 Proceedings. International Conference on Electronics Packaging 2010, Sapporo, Japan, (555-560). 12-14 May 2010. 71 442
Nogita K., Kennedy J., Amsler J., Greaves M., Tuesley C. and Nishimura T. (2014). Lead-free solders for solar and electric vehicles- Reflections on the Bridgestone World Solar Challenge 2013 in 'Arrow1'. In: 2014 International Conference on Electronics Packaging, ICEP 2014. 2014 International Conference on Electronics Packaging, ICEP 2014, Toyama, (10-13). April 23, 2014-April 25, 2014. doi:10.1109/ICEP.2014.6826652 22   Cited 0 times in Scopus0 0
Nogita, K. and Nishimura, T. (2008) Nickel-stabilized hexagonal (Cu, Ni)(6)Sn-5 in Sn-Cu-Ni lead-free solder alloys. Scripta Materialia, 59 2: 191-194. doi:10.1016/j.scriptamat.2008.03.002 40   55 Cited 67 times in Scopus67 0
Pei J.-J., An W.-L., Zhou X.-W., Nishimura T., Norberg J., Benedikz E., Gotz J. and Winblad B. (2006) P70 S6 kinase mediates tau phosphorylation and synthesis. FEBS Letters, 580 1: 107-114. doi:10.1016/j.febslet.2005.11.059 15   41 Cited 40 times in Scopus40 0
Nogita, K., Nishimura, T., Suenaga, S., McDonald, S. D., Sweatman, K. and Tsukamoto, H. (2008). Role of Ni in stabilization of intermetallic compounds in Sn-Cu alloys. In: Japanese Institute of Metals Annual Autumn Meeting 2008, Kumamoto, Japan, (). 23-25 September 2008. 43  
Tsukamoto, H., Nishimura, T., Suenaga, S. and Nogita, K. (2010) Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substrates. Materials Science and Engineering B, 171 1-3: 162-171. doi:10.1016/j.mseb.2010.03.092 158   12 Cited 13 times in Scopus13 0
Ventura, T., Nogita, K., Gourlay, C., Nishimura, T., Rappaz, M. and Dahle, A.K. (2007). Solidification characteristics of lead-free solder Sn-0.7Cu-0.06Ni. In: Proceedings of the 5th Decennial International Conference on Solidification Processing. Solidification Processing 2007, Sheffield, United Kingdom, (651-655). 23-25 July 2007. 120  
Sweatman, Keith, Read, J., Nishimura, T. and Nogita, Kazuhiro (2011). The effect of microalloy additions on the morphology and growth of interfacial intermetallic in low-Ag and no-Ag Pb-free solders. In: Proceedings of SMTA International. SMTA International, Fort Worth, Texas, United States, (). 16-20 October 2011. 29  
Nogita, K., Read, J., Tsukamoto, H., McDonald, S. D., Gourlay, C. M. and Nishimura, T. (2009). The Effect of Ni on Phase Stability in Cu6Sn5. In: Japan Institute of Metals Autumn Meeting 2009, Kyoto, Japan, (). 15-17 September 2009. 32  
Nogita, K., Gourlay, C. M., Nishimura, T., Suenaga, S., McDonald, S. D. and Tsukamoto, H. (2009). The influence of Ni content on cracking in IMC reaction layers between Sn-Cu-Ni solders and Cu substrates. In: Proceedings of TMS 2009. TMS 2009, San Francisco, California, USA, (). 15-19 February 2009. 58  
Tsukamoto, H., Nishimura, T., Suenaga, S., McDonald, S. D., Sweatman, K. W. and Nogita, K. (2011) The influence of solder composition on the impact strength of lead-free solder ball grid array joints. Microelectronics Reliability, 51 3: 657-667. doi:10.1016/j.microrel.2010.10.012 66   8 Cited 12 times in Scopus12 0
Sweatman, Keith, Nishimura, T. and Nogita, Kazuhiro (2012). The stability of Cu6Sn5 in the formation and performance of lead-free solder joints. In: Proceedings of SMTA Pan Pacific Microelectronics Symposium. SMTA Pan Pacific Microelectronics Symposium, Kaui, Hawaii, United States, (). 14-16 February 2012. 25